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Wafer bonding
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41	PDF Document Add to Reading List Source URL: socrates.berkeley.edu Language: English - Date: 2012-01-18 12:08:54 Semiconductor device fabrication CERN Particle detectors Antiproton Decelerator Antihydrogen Semiconductor detector Wire bonding Wafer Antiproton Physics Antimatter Particle physics
42	PERSPECTIVES wafer bonding approach allows point defects and potentially also waveguides to be introduced parallel to the layers by proper lithography. In addition, wafer bonding can incorporate a layer that acts as a li Add to Reading List Source URL: zhuang.harvard.edu Language: English - Date: 2005-11-02 16:55:06 Force spectroscopy DNA Nucleosome Single-molecule experiment Condensin Biology Molecular biology Optical tweezers
43	Microsoft Word - R. Dean CV 5_13.doc Add to Reading List Source URL: www.eng.auburn.edu Language: English - Date: 2013-05-15 12:10:09 Engineering Semiconductor device fabrication Nanotechnology Mechanical engineering Microelectromechanical systems Transducers Microfabrication Vibrating structure gyroscope Wafer bonding Materials science Technology Microtechnology
44	The Advantages of Integrated MEMS to Enable the Internet of Moving Things WHITE PAPER JUNE 2014 The availability of contextual information regarding motion and direction is transforming consumer device Add to Reading List Source URL: www.mcubemems.com Language: English - Date: 2014-06-25 02:33:18 Electromagnetism Microelectromechanical systems Accelerometer Kionix Wafer bonding CMOS Nasiri-Fabrication RF MEMS Technology Materials science Microtechnology
45	Microsoft PowerPoint - Sparks Microtech - Slides[removed]Compatibility Mode] Add to Reading List Source URL: www.techconnectworld.com Language: English - Date: 2010-06-15 12:08:49 Semiconductor device fabrication Electronics manufacturing Semiconductors Electronic design Mechanical engineering Microelectromechanical systems Wafer bonding Microfluidics Packaging and labeling Technology Microtechnology Materials science
46	Ionut Radu SOITEC, Senior Expert - R&D, Bernin (France) Ionut Radu joined Soitec’s R&D organization in 2006 as staff scientist to develop wafer bonding solutions for advanced SOI substrates, such as sSOI, UTBOX and FD- Add to Reading List Source URL: www.nanofis.net Language: English - Date: 2014-06-12 15:59:24 Materials science Wafer Technology EV Group Semiconductor device fabrication Soitec Microtechnology
47	ECF15 STEADY-STATE MEASUREMENT OF THE INTERFACE FRACTURE RESISTANCE IN WAFER BONDING Y. Bertholet1,2, F. Iker1,3, X.X. Zhang1,3, J.P. Raskin1,3 and T. Pardoen1,2,* 1 Add to Reading List Source URL: www.structuralintegrity.eu Language: English - Date: 2009-10-23 06:25:17 Glass physics Continuum mechanics Semiconductor device fabrication Mechanics Fracture toughness Fracture Brittleness Thermal oxidation Microelectromechanical systems Materials science Chemistry Physics
48	Ziptronix and Customer Pursue Lower-Cost 3D Memory With DBI® Wafer Bonding and Interconnect Technology Ability to Replace Die Stacking with High-strength Wafer Stacking Simplifies Process Flows, Increases Interconnect D Add to Reading List Source URL: www.ziptronix.com Language: English - Date: 2012-12-12 11:53:15 Electronics Integrated circuit Wafer Through-silicon via Silicon Three-dimensional integrated circuit Wafer backgrinding Semiconductor device fabrication Chemistry Microtechnology
49	Microsoft Word - Ziptronix_EVG_PR_FINAL.docx Add to Reading List Source URL: www.ziptronix.com Language: English - Date: 2014-05-28 10:11:14 Electronics Electronics manufacturing EV Group Semiconductors Wafer bonding Three-dimensional integrated circuit Microelectromechanical systems Integrated circuit Wafer Microtechnology Semiconductor device fabrication Technology
50	Microsoft Word - SF80904.FINAL.IMAPS.WLP_BalancingDevReqsnMatlsProperties.doc Add to Reading List Source URL: www.suss.com Language: English - Date: 2012-04-27 03:43:28 Technology SUSS MicroTec Microelectromechanical systems Wafer Glass frit bonding Three-dimensional integrated circuit Thermal oxidation Nasiri-Fabrication RF MEMS Microtechnology Semiconductor device fabrication Materials science